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chore(sdk): bump llama.cpp submodule to 94256114c - #1483

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Mengsheng Wu (mengshengwu) merged 1 commit into
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chore/bump-llamacpp-latest
Sep 23, 2026
Merged

Mengsheng Wu (mengshengwu) merged 1 commit into
mainfrom
chore/bump-llamacpp-latest

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Summary

Bumps third-party/llama.cpp from c550d2f60 (merged via #1475) to upstream master tip 94256114c (49 commits): Hexagon buffer/DMA improvements, server fixes, and general ggml/CUDA/Metal/OpenCL changes. All 6 vendored Hexagon/OpenCL patches apply cleanly against the new tip — no refresh needed.

Test plan

  • cmake --preset arm64-linux-snapdragon-release -B build-linux . && cmake --build build-linux -j succeeds on Linux ARM64 (Docker toolchain container) with all 6 vendored llama.cpp patches applying cleanly against the bumped tip
  • geniex-bench and llama-server (built with -DLLAMA_BUILD_SERVER=ON) both produce valid aarch64 binaries and run on an IQ-9075 EVK (QCS9075) device
  • unsloth/gemma-4-E2B-it-GGUF (Q4_K_M) and unsloth/Qwen3.5-0.8B-GGUF (Q4_K_M) both generate correct image descriptions through llama-server's /v1/chat/completions with an embedded image, confirming VLM inference still works after the bump

Bumps third-party/llama.cpp from c550d2f60 to upstream master tip
94256114c (49 commits): Hexagon buffer/DMA improvements, server fixes,
and general ggml/CUDA/Metal/OpenCL changes. All vendored Hexagon and
OpenCL patches apply cleanly against the new tip; no refresh needed.

Signed-off-by: Mengsheng Wu <mengshengwu@outlook.com>
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